Technical Outline of Diaphragm Forming with Teonex® PEN Films
Teonex® PEN Melting Point: Tm=265 0C
Lowest Temperature PEN Resistance: -50 0C
Crystallization Temperature: Tc=210 0C
Film-Glass Transition Temperature: Tg=155 0C
Suggested Temperature of Forming & Drooping from the Tooling as below:
|
Materials
|
Tg，0C
|
Experienced Formula or Forming
Temp.= Tg+35~400C
|
Temp. of Dropping
Tooling
|
|
PEN
|
155
|
1560C ~1610C
|
600C ~ 800C
|
|
PET
|
78
|
1130C ~1180C
|
< Tg
|
Characteristics vs. Serveral Plastic Films (Reference Data)
|
Property
|
Test Method
|
Unit
|
PEN
|
PI
|
PEI
|
PPS
|
|
Ultimate Tensile Strength
|
ASTM D882-88
|
Kg/m2
|
2,250
|
2,460
|
1,060
|
2,040
|
|
Modulus (MD)
|
ASTM D882-88
|
%
|
65
|
75
|
50
|
50
|
|
Continuous Use
Temperature (Mechanical)
|
ASTM D882-88
|
0C
|
160
|
240
|
170
|
180
|
|
Continuous Use
Temperature (Electrical)
|
UL
|
0C
|
180
|
240
|
180
|
180
|
|
Glass Transition Temp.
|
UL
|
0C
|
155
|
410
|
212
|
90
|
|
Melting Temperature
|
|
0C
|
262
|
>500
|
365
|
285
|
|
Dielectric Strength
|
ASTM D150-81
|
V/25ｕm
|
7,000
|
7,700
|
3,500
|
8,000
|
|
Dielectric Constant(@1.0MHz)
|
ASTM D150-81
|
|
3.16
|
3.5
|
3.2
|
3
|
|
Moisture Absorption
|
IPC-TM-650
|
%
|
0.6
|
2.9
|
0.25
|
0.01
|
|
Density
|
|
g/cm3
|
1.36
|
1.42
|
1.27
|
1.35
|
|
Flammability
|
UL 94
|
|
VTM-2
|
V-0
|
V-0
|
VTM-0
|
|
|
|
|
| Select Image |
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