Product Description

Technical Outline of Diaphragm Forming with Teonex^® PEN Films

Teonex^® PEN Melting Point: Tm=265 ⁰C
Lowest Temperature PEN Resistance: -50 ⁰C
Crystallization Temperature: Tc=210 ⁰C
Film-Glass Transition Temperature: Tg=155 ⁰C 

Suggested Temperature of Forming & Drooping from the Tooling as below:

Materials	Tg，0C	Experienced Formula or Forming Temp.= Tg+35~400C	Temp. of Dropping Tooling
PEN	155	1560C ~1610C	600C ~ 800C
PET	78	1130C ~1180C	< Tg

                                        

Property	Test Method	Unit	PEN	PI	PEI	PPS
Ultimate Tensile Strength	ASTM D882-88	Kg/m2	2,250	2,460	1,060	2,040
Modulus (MD)	ASTM D882-88	%	65	75	50	50
Continuous Use Temperature (Mechanical)	ASTM D882-88	0C	160	240	170	180
Continuous Use Temperature (Electrical)	UL	0C	180	240	180	180
Glass Transition Temp.	UL	0C	155	410	212	90
Melting Temperature		0C	262	>500	365	285
Dielectric Strength	ASTM D150-81	V/25ｕm	7,000	7,700	3,500	8,000
Dielectric Constant(@1.0MHz)	ASTM D150-81		3.16	3.5	3.2	3
Moisture Absorption	IPC-TM-650	%	0.6	2.9	0.25	0.01
Density		g/cm3	1.36	1.42	1.27	1.35
Flammability	UL 94		VTM-2	V-0	V-0	VTM-0

Price Terms︰ FOB Dongguan

Payment Terms︰ TT in advance

Packing︰ Standard export packing

Lead Time︰ 3 days

SKU︰ 5000KGS

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